JPH021920Y2 - - Google Patents
Info
- Publication number
- JPH021920Y2 JPH021920Y2 JP7153284U JP7153284U JPH021920Y2 JP H021920 Y2 JPH021920 Y2 JP H021920Y2 JP 7153284 U JP7153284 U JP 7153284U JP 7153284 U JP7153284 U JP 7153284U JP H021920 Y2 JPH021920 Y2 JP H021920Y2
- Authority
- JP
- Japan
- Prior art keywords
- shielding plate
- printed wiring
- wiring board
- metal plate
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153284U JPS60183498U (ja) | 1984-05-15 | 1984-05-15 | 遮蔽板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7153284U JPS60183498U (ja) | 1984-05-15 | 1984-05-15 | 遮蔽板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183498U JPS60183498U (ja) | 1985-12-05 |
| JPH021920Y2 true JPH021920Y2 (en]) | 1990-01-17 |
Family
ID=30609117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7153284U Granted JPS60183498U (ja) | 1984-05-15 | 1984-05-15 | 遮蔽板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183498U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3497114B2 (ja) * | 2000-04-24 | 2004-02-16 | 北川工業株式会社 | 電子部品の被覆構造及び電子部品の被覆方法 |
-
1984
- 1984-05-15 JP JP7153284U patent/JPS60183498U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183498U (ja) | 1985-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5414220A (en) | Flexible wiring cable | |
| US5030800A (en) | Printed wiring board with an electronic wave shielding layer | |
| US9210795B2 (en) | Conformal reference planes in substrates | |
| US5262596A (en) | Printed wiring board shielded from electromagnetic wave | |
| JPH02198198A (ja) | 電磁波シールド層を備えるプリント配線板 | |
| JPH07225634A (ja) | 情報処理装置 | |
| US4737597A (en) | Shield case | |
| MY128653A (en) | Electronic component of a high frequency current suppression type and bonding wire for the same | |
| JPH021920Y2 (en]) | ||
| JP3191517B2 (ja) | フレキシブル印刷配線板のシールド装置 | |
| JPH073660Y2 (ja) | Ｅｍｉ対策用回路基板 | |
| JPH1131891A (ja) | プリント基板の保持方法および保持構造 | |
| JPS59188992A (ja) | プリント配線基板 | |
| JPH04261097A (ja) | 多層プリント基板 | |
| JP2002176231A (ja) | 両面可撓性回路基板 | |
| JP2819775B2 (ja) | 混成集積回路装置 | |
| KR20060018545A (ko) | 전자기파 차폐된 연성인쇄회로기판 | |
| JPH0864984A (ja) | 低ｅｍｉ構造 | |
| JPH02249291A (ja) | プリント配線基板 | |
| JPH03179796A (ja) | ハイブリッド集積回路 | |
| JP3221625B2 (ja) | 電子部品用電磁波遮蔽フィルム及びその製造方法 | |
| JPS61119093A (ja) | プリント基板 | |
| JPS62128190A (ja) | クロスト−ク防止プリント基板 | |
| JPH03224286A (ja) | 導電層を利用したフレキシブル配線基板 | |
| JPH05129750A (ja) | フレツクスリジツト配線板 |